31-05-2023
LTCC Low Temperature Co-Firing Ceramic Technology
It is an advanced passive integration and hybrid circuit packaging technology that can package three major passive components (including resistors, capacitors, and inductors) and various passive components (such as filters, transformers, etc.) in multi-layer wiring substrates, and integrate them with active devices (such as power MOS, transistors, IC circuit modules, etc.) into a complete circuit system.